We Put Plasma To Work For You TM
We Put Plasma To Work For You TM
As discussed in our Atmospheric Plasma Primer, our technology enables the creation of a high-energy environment that results in unique opportunities for novel chemical reactions and processes. Because our products generate plasma electrically, rather than thermally, and because they can operate at atmospheric pressures, they are uniquely suited to a variety of applications. Furthermore, our high-power systems are pushing the envelope and redefining the realm of Atmospheric Plasma Treatment as we know it.
Below are a number of the key areas of application of our technology, however, we are only beginning to fully realize the extraordinary potential of this powerful technology.
Atmospheric Plasma is used to change the surface chemistry of materials without affecting their bulk properties. An air plasma creates polar surface groups which impart exceptional wettability on normally hydrophobic materials. This is commonly used to promote adhesion and bonding between dissimilar materials or low surface energy materials such as plastics. Air atmospheric plasma treated surfaces have been shown to have enhanced adhesive bond strength, over 15 times stronger than equivalent untreated surfaces. Materials that were previously thought of as being incompatible for bonding can now be successfully bonded using Atmospheric Plasma Technology.
Non-stick or anti-fouling surfaces are produced by changing the chemistry of the plasma source. Surfaces with Teflon-like stain resistance can be produced by just a momentary exposure to the correct plasma chemistry. With the correct patterning technology, it is possible to make ordered arrays of hydrophilic and hydrophobic regions on virtually any surface. The ability to create these "islands" of different surface chemistries opens exciting opportunities for combinatorial chemistry applications.
Oxygen containing plasmas, such as air, will etch organic materials. The process converts the organics into gaseous carbon dioxide and water vapor. Surface contaminants like machining oils and lubricants can be etched from the surface, leaving a pristine oil-free substrate. Plastics and other polymeric layers can be selectively etched. Semiconductor applications include etching of photo-resists and general surface cleaning.
Hydrogen based atmospheric plasmas have been successfully used to etch metal oxides. One application that AP Solutions has worked on is removal of the thin oxide layer that forms on solder bumps on semiconductor interconnects. This oxide layer has been known to cause interconnect failures on chip manufacturing lines. Atmospheric plasma based processes are available to reduce/etch a number of oxide materials.
Atmospheric plasma in air has been shown to effectively break down organic molecules such as hexanes, toluene, acetone, and other VOCs into carbon dioxide and water vapor. Other common industrial contaminants can also be abated using the right combination of plasma chemistry and reactor design.
AP Solutions has developed a number of proprietary technologies to augment the plasma destruction of contaminants and pollutants. Our developmental ANAGLOW™ filter system uses atmospheric plasma and a special catalytic process to further enhance the breakdown of organics in process gas airstreams. As an air filter, the ANAGLOW™ has been shown to sterilize and destroy pathogenic organisms such as E. Coli, Listeria Innocua, and Anthrax surrogates. It also has the ability to disable and destroy organic chemical warfare agents. Decontamination of buildings, personnel, and equipment can be realized using this technology and others that AP Solutions is developing.
Atmospheric plasmas are increasingly being used to deposit a wide variety of thin films on many different substrate materials. Temperature sensitive substrates, such as polymers, can have high melting point coatings deposited on them without damaging the plastic substrate. An example would be the deposition of a thin layer of glass (melting point 1300°C) onto plastic eyeglass lenses (melting point 150°C) to produce a scratch resistant coating. Atmospheric plasmas can be used to enhance existing processes by eliminating some and sometimes all vacuum system requirements. Many vacuum CVD and PECVD (plasma enhanced chemical vapor deposition) processes can be realized at atmospheric pressure. This can transform a vacuum-based batch process into a vacuum-free continuous process. The move to APECVD eliminates the capital equipment expenditures, excessive energy requirements and upkeep normally needed to maintain industrial-scale vacuum systems.
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